Through interviews with some manufacturers and industry insiders, this paper explores the development trend of sensors in the fields of automobiles, mobile phones and tablets, and industries. According to the forecast of China Electronics and Information Industry Development Research Institute, the domestic sensor market will grow 31% year-on-year in the next five years. The sensor market in the fields of automobile, logistics, mining exploration, coal mine safety supervision, security, and RFID tag cards has grown rapidly. Among them, consumer products and the automotive industry have the largest demand for sensors. Overall, the Chinese sensor market has broad prospects. Automotive sensor Zhao Yanhui, ADI Asia Pacific MEMS product and application manager: The smart sensor technology represented by MEMS has developed rapidly. The focus of MEMS technology development in the future is mainly reflected in the following aspects. 1. Miniaturize while reducing power consumption. Micro devices, such as micrometers and even nanometers, will appear while reducing power consumption. 2. Miniaturization while improving accuracy, the MEMS accelerometer can achieve the noise characteristics of the quartz accelerometer, ensure the small volume of the MEMS gyroscope while obtaining the bias stability of the fiber optic gyroscope, and can provide much better than the fiber optic gyroscope. Impact resistance. 3. The trend of integration and intelligence, namely the integrated manufacturing technology of MEMS and IC and the integrated manufacturing technology of multi-parameter MEMS sensor, and the automation of signal detection on the basis of integration. These trends require semiconductor manufacturers to offer highly integrated, MEMS sensor modules with higher accuracy, stability, and intelligence. Based on this, ADI continues to focus on developing core technologies for MEMS sensors to provide the best industrial grade accelerometers and gyroscopes. At the same time, ADI will continue to provide more highly integrated MEMS sensors to meet the needs of different markets. Research reports from third-party companies show that the growth rate of safety-based automotive semiconductor components is at the forefront of automotive electronics. In the field of automotive active safety, rollover and stability control (ESC) is a new improvement to today's mainstream safety systems. A MEMS acceleration sensor and an angular velocity sensor are needed to sense the body posture. At the same time, since such sensors are often installed in a position where vibration is relatively bad, the sensor is required to have high vibration shock resistance. This is a challenge for MEMS sensors. ADI's new generation of airbag acceleration sensors ADXL185/ADXL189/ADXL188/ADXL288, the angular speed sensor ADXRS800 for ESC and Rollover/Roll stability integrates numerous system functions such as self-test, signal bandwidth setting, threshold triggering, Excellent resistance to vibration and so on. At the same time, digital interfaces and high levels of integration help customers reduce system costs. Du Fu, Marketing Director of China Automotive Electronics Division, Infineon Technologies (China) Co., Ltd.: Infineon products are characterized by comprehensive semiconductor product development and manufacturing processes in sensors, microprocessors and power drivers. Based on Infineon's silicon MEMS technology, SiP, SoC and advanced packaging technologies, its sensor products include wireless sensing and control, such as RKE, 24G/77G radar chips; CMOS image chips; magnetoelectric effect sensors, such as position sensors, Speed ​​sensor, pressure sensor and TPMS sensor. In order to meet the functional safety requirements of the automotive industry in ISO26262, Infineon has introduced a dual-core version of the angle/position sensor, which integrates two identical sensors in a 1mm thick package for redundant design to match customer application systems. The hardware and software are designed to achieve the highest level of ASIL D functional safety. Each core sensor has its own independent pin for independent power supply and signal processing. The two cores are placed in the same vertical plane for good horizontal position detection. The angle of change. Infineon's tire pressure monitoring (TPMS) sensor chip integrates microprocessor, signal processing and wireless transmit transmission functions in a single-chip package, eliminating the need for customer secondary verification, simplifying customer design and making it easy Customer design integration. Internet of Things Sensor Li Jinhua, general manager of Sensirion Greater China, in the future, not only will the production and proportion of sensors increase, but the integration of sensor data and the Internet of Things in the cloud will explode. This will have a huge impact on all aspects of human life and every industry; it also means that people have higher requirements in areas such as health, comfort and energy efficiency. Therefore, Sheng Sirui's strategy is not limited to a single market environment. In addition, sensors, especially environmental monitoring sensors, must be considered in addition to high-precision requirements, and must consider how to push the sensor to be more compact, low-power and integrated. For many years, Sheng Sirui has focused on the development and production of temperature and humidity sensors, gas and liquid flow sensors and differential pressure sensors. And it is the world's first manufacturer of temperature and humidity sensors using wafer level chip packaging. Sheng Sirui's sensors are based on its innovative CMOSens? The core patented technology integrates sensitive components with signal processing circuitry on a tiny CMOS silicon chip. This technology, combined with advanced semiconductor technology, designs the microsensor structure on specially developed, patented semiconductor components. This sensor chip provides accurate and reliable measurements of the required physical quantities such as relative humidity, temperature, or mass flow. Sheng Rui has introduced the landmark wafer-level chip package temperature and humidity sensor SHTW1, which not only has the conventional functions of digital temperature and humidity sensors, but also has ultra-small size (1.3 x 0.7 x 0.5mm) and 1.8V power supply and ultra-low power. The consuming nature paves the way for applications on wearables and mobile devices, allowing environmental monitoring to fit into our lives. So far, Sheng Sirui is the only manufacturer that offers high-end sensor hardware, drivers, software solutions, applications and cloud services. Mike Ballard, Senior Manager and Head of Cloud Support Projects at Microchip's Appliance Solutions: At present, we can see the needs of sensor applications in many areas, such as smoke/carbon monoxide detection, energy measurement, user interface, and pulse oximetry. Detect application. In recent years, Microchip has provided a free software protocol stack for the Internet of Things market, also in Bluetooth? And Wi-Fi? Some strategic acquisitions have been made in the core technology and occupy an important position in the IoT market. What are the company's existing 8-, 16-, and 32-bit PICs? Microcontrollers are well suited for this market and can be found in many of today's IoT products. For example, does Microchip offer embedded Wi-Fi for IoT? And Bluetooth? Modules, which can be used with more than 190 PICs with ultra low power (XLP) technology? MCU works together. These XLP MCUs provide sleep currents as low as 9 nA and operating currents as low as 30 μA/MHz, and their low-power peripherals combine multiple low-power modes to build long-term battery-powered IoT nodes. These all meet the low power requirements of IoT applications. Gao Xiaolong, Marketing Manager of Freescale Sensor and Consumer Electronics: According to the design principle and technical parameters of MEMS sensors, Freescale divides sensors into five categories: acceleration sensors, electronic compasses, barometers, gyroscopes, Touch sensor. Freescale's innovative products are: ◠MMA9555: MCU+LOW-G 2-in-1 smart sensor with integrated pedometer, sleep monitoring and gesture recognition algorithm; ◠FXAS21002: Ultra low power gyroscope (~2.6mA (AcTIve), 1.5mA (Ready), 2mA (Standby). Can be used in the following cases. ◠Smart Bracelet: Based on FXLC95000 (MCU+LOW-G 2-in-1) smart bracelet reference design, in addition to supporting pedometer, sleep monitoring and gesture recognition, it will also integrate Freescale SENSOR FUSION algorithm to support more Sensor application. ◠Air Mouse: Based on the FSL MCU+SENSOR air mouse reference design, it supports Bluetooth communication and various sensor applications. Battery Cable,Lithium Battery Cable,Battery Cable Connector,Silicone Cover Wire Harness Dongguan ZhiChuangXing Electronics Co., LTD , https://www.zcxelectronics.com
June 20, 2024