A new generation of MEMS triaxial acceleration sensors

Suzhou Minxin Microelectronic Technology Co., Ltd. announced the ultra-small CSP (Chip Scale Package) triaxial accelerometer for mobile terminals: MSA330. The MSA330 is the world's smallest packaged three-axis accelerometer measuring 1.075mmx1.075mmx0.60mm (length x width x height).

The MSA330 uses world-leading wafer level bonding and through-silicon-via (TSV) technology to round the three-axis acceleration sensor unit (MEMS) and signal processing unit on the sensor wafer On-chip ASICs are connected, eliminating the need for traditional wire bonding, shortening the product packaging process, and greatly improving the product's processing efficiency, thereby reducing the cost of the product. The MSA330 is the world's first WLCSP (wafer level chip size package) that employs both advanced WLP and copper TSV technology and is technologically advanced over the industry.

MSA330 package size is only 1.075mmx1.075mmx0.6mm, compared to the existing minimum size of similar products, the area is reduced by 30%, for the industry's common 2mmx2mm program, the area is reduced by more than 70%; while the thickness of the product is only 0.6mm (including 0.2 The mm ball) is only 0.5mm after surface mount (SMT), and it is far ahead of similar products. The ultra-small size makes the MSA330 more cost-effective for consumer electronics and mobile and wearable product manufacturers that are sensitive to size and price.

The MSA330 provides user-selectable I2C/SPI interface with 14bits/12bits/10bits/8bits data accuracy, user-adjustable measurement range of ±2g/±4g/±8g/±16g and multiple interrupt functions (direction, jitter, and drop) Wait).