Compared with developed countries in Europe and the United States, China’s sensor development is late and its development level is relatively lagging. However, it has greatly improved the commemoration of the sensor industry recently. There are more than 1,600 enterprises and institutions in the country engaged in sensor research, development and production. However, compared with foreign countries, I have been in the downstream state of the overall level of sensors, lack of core technology, can not meet the needs of the domestic market, the overall level is still at the level of foreign countries in the early 1990s.
In 2012, the sensor focuses on the following major development plans:
With industrial control, automotive, communications and environmental protection as the key service areas, with sensors, flexible components, optical components, and special circuits as the key targets, we will develop original technologies and products with independent intellectual property rights;
Based on the MEMS process, relying on integrated, intelligent and networked technologies, the company will strengthen the development of manufacturing processes and new sensors and instrumentation components, so that the leading products will reach and approach the advanced level of similar foreign products;
To increase the variety, improve quality and economic efficiency as the main goal, accelerate industrialization, so that the domestic sensor occupancy rate of the species reached 70% to 80%, up to 60% of high-end products.
There are still a lot of problems:
(1) Poor scientific and technological innovation, the core manufacturing technology lags far behind that of foreign countries, there are few products with independent intellectual property rights, and the varieties are incomplete. The product technology level differs from that of foreign countries by about 15 years.
(2) The investment intensity is low, the research equipment and production technology equipment are backward, the achievement level is low, and the product quality is poor.
(3) The disconnect between science and technology and production, affecting the transformation of scientific research results, the overall strength is relatively low, and the potential for industrial development is insufficient.
Key Development Objectives for Sensor Industry in 2012 (1) MEMS Process and Next-Generation Solid State Sensor Microstructure Manufacturing Processes: Deep Reactive Ion Etching (DRIE) Process or IGP Process; Packaging Process: Such as Normal Temperature Bonding, Flip-Flop, No-Stress Micro-Thin Structure Packaging, multi-chip assembly process; new sensors: such as micro-silicon capacitive sensors, micro-silicon mass flow sensors, aerospace dynamic sensors, micro-sensors, automotive pressure, acceleration sensors, environmental protection and other micro-chemical sensors.
(2) Integrated process and multivariable composite sensor microstructure integrated manufacturing process; Multivariable composite sensors for industrial control, such as: pressure, static pressure, temperature three-variable sensors, pressure, wind, temperature, humidity four-variable sensors, micro silicon composite Strain pressure sensor, display sensor.
(3) Intelligent technology and intelligent sensor signals Wired or wireless detection, conversion processing, logic judgment, function calculation, two-way communication, self-diagnosis and other intelligent technologies; smart multivariable sensors, smart power sensors and various smart sensors, transmission Device.
(4) Networked technology and networked sensor sensor networking technology; Networked sensors enable the sensor to have industrial standard interface and protocol functions.
In 2012, the sensor focuses on the following major development plans:
With industrial control, automotive, communications and environmental protection as the key service areas, with sensors, flexible components, optical components, and special circuits as the key targets, we will develop original technologies and products with independent intellectual property rights;
Based on the MEMS process, relying on integrated, intelligent and networked technologies, the company will strengthen the development of manufacturing processes and new sensors and instrumentation components, so that the leading products will reach and approach the advanced level of similar foreign products;
To increase the variety, improve quality and economic efficiency as the main goal, accelerate industrialization, so that the domestic sensor occupancy rate of the species reached 70% to 80%, up to 60% of high-end products.
There are still a lot of problems:
(1) Poor scientific and technological innovation, the core manufacturing technology lags far behind that of foreign countries, there are few products with independent intellectual property rights, and the varieties are incomplete. The product technology level differs from that of foreign countries by about 15 years.
(2) The investment intensity is low, the research equipment and production technology equipment are backward, the achievement level is low, and the product quality is poor.
(3) The disconnect between science and technology and production, affecting the transformation of scientific research results, the overall strength is relatively low, and the potential for industrial development is insufficient.
Key Development Objectives for Sensor Industry in 2012 (1) MEMS Process and Next-Generation Solid State Sensor Microstructure Manufacturing Processes: Deep Reactive Ion Etching (DRIE) Process or IGP Process; Packaging Process: Such as Normal Temperature Bonding, Flip-Flop, No-Stress Micro-Thin Structure Packaging, multi-chip assembly process; new sensors: such as micro-silicon capacitive sensors, micro-silicon mass flow sensors, aerospace dynamic sensors, micro-sensors, automotive pressure, acceleration sensors, environmental protection and other micro-chemical sensors.
(2) Integrated process and multivariable composite sensor microstructure integrated manufacturing process; Multivariable composite sensors for industrial control, such as: pressure, static pressure, temperature three-variable sensors, pressure, wind, temperature, humidity four-variable sensors, micro silicon composite Strain pressure sensor, display sensor.
(3) Intelligent technology and intelligent sensor signals Wired or wireless detection, conversion processing, logic judgment, function calculation, two-way communication, self-diagnosis and other intelligent technologies; smart multivariable sensors, smart power sensors and various smart sensors, transmission Device.
(4) Networked technology and networked sensor sensor networking technology; Networked sensors enable the sensor to have industrial standard interface and protocol functions.
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