The advantage of USB Cable Type C is that it supports higher current, that is that more current can be passed by Type-C in the same time. In this way, the charging speed of the device can be accelerated. At present, the charging current of most Type-C data lines is generally 2A. If the charging rate of 3A is to be reached, a high-current wall charging matching it is required. That is to say, if the wall charge only supports 1A, whether it is charged with 2A or 3A data line, there is no difference fundamentally. If the current supported by the wall charging is 2A, and the type-C data cable of 2A/3A is matched, the effect can be significantly changed.
The highlights of Type-C interface are thinner design, faster transmission speed (USB3.1 up to 10Gbps) and stronger power transmission (up to 100W).The biggest feature of Type-C double-sided plugable interface is that it supports double-sided insertion of USBinterface. Officially solved the USB never insert the worldwide problem, the front and the back of the random plug.The USB Cable used with it must also be thinner and lighter.
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Wafer foundry has long been more than 70% market share is controlled by Taiwan's wafer foundry TSMC and UMC. Singapore Charter and China SMIC are rising stars in recent years, but located in the Asian border region of North Asia Russia, South Asia India's emerging powers cannot be ignored. Recently, the industry has announced that the Russian fab Angstrem's advanced 0.13-micron process technology has been fully established and has been aligned with the CPU giant AMD to license its technology sources. It is worth noting that with the rise of Russia and India, China's semiconductor companies will be able to compete against each other. If they do not break away from price competition, they will face great threats in the future.
The International Semiconductor Equipment and Materials Association (SEMI) held a seminar in Moscow on the 6th. Angstrem chairman Anatoly Sukhoparov said that Angstrem technology partners not only introduced technology, but also assisted in the import of semiconductor equipment. In the future, Angstrem will adopt copper that is indispensable in advanced technology. Process (Cumetal). According to the planning schedule of Angstrem, the plant construction will be completed in June 2008, the process verification will be carried out in the second half of 2008, and the mass production will be completed in 2009. In addition to the basic CMOS process, mixed and non-volatile memory technology products will also be provided.
Angstrem expects the initial production capacity of the 8-inch factory to be about 1.2 to 15,000 pieces, and will challenge the level of 20,000 pieces. The industry is more speculative, Angstrem technology partners should be interested in expanding the super-generation of sub-contracting. At present, for AMD, the 65-nanometer process CPU platform is mainly licensed by Singapore, and the 0.13-micron process belongs to the second generation before the interval. product. However, Angstrem declined to comment on who the partner is.
In addition to Russia, in recent years, India has spared no effort in attracting foreign investment, especially IC design has been second to none, including international manufacturers Intel, AMD, Infineon, Freescale, Philips and Samsung Electronics. The establishment of an IC design center in India, STMicroelectronics (STM) also announced the expansion of IC design base in Noida, India, it is worth noting that the global semiconductor leader Intel Chairman Barrett visited India more than eight times.
In fact, in recent years, wafer foundries in Taiwan have also laid out semiconductor markets in Northeast Asia and Southeast Asia. TSMC has offices in Japan and South Korea in the early years, and then set up offices in Bangalore, which is known as Silicon Valley in India. UMC has an 8-inch fab UMCJ in Japan and a customer service base in Hyderabad Technology Park, India.
Semiconductor companies pointed out that in recent years, including the rise of North Asia's Russian fabs and South Asia's IC design industry, it will bring great pressure to Chinese semiconductor companies. In particular, Chinese semiconductor companies are facing poor profits under the active expansion of production capacity. The heavy burden is not only far behind in the forefront of the wafer fab in Taiwan, but in the face of the trend of chasing troops, the pressure is increasing, and the future should be based on cost and price-oriented thinking, otherwise it will face severe competition.
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In addition, the device equipped with the Type-C interface can be charged by connecting the mobile power supply through the Type-C cable or Usb C Cable. Users do not need to carry the charging cable, but can have the wall charging and Type-C cable. In addition, when selecting a Type-C charging cable, We should pay attention to the current limit. The charging data cable 1A does not have fast charging performance, 2A is the most commonly used Type-C charging data line, and 3A is the best data line at present. If you want to have fast charging effect, you must choose the Type-C charging data line with 3A current.
February 16, 2024